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Micron Breaks Ground on New York Megafab

Published 1/29/2026
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Micron broke ground in January of 2026 on a $100 billion complex for the creation of advanced memory chips in Clay, N.Y. With up to four fabs, the development will be the largest semiconductor facility in the United States and represents the largest private investment in the state's history. The visionary campus will leverage groundbreaking technologies to meet the growing demands of AI systems and devices, driving economic growth and accelerating innovation.

The U.S. Department of Commerce is providing $6.14 billion in direct funding through the CHIPS and Science Act. Coupled with $5.5 billion in state incentives, the project aims to establish a massive domestic semiconductor manufacturing ecosystem over the next two decades, with production initially commencing at the site in 2030.

The megafab is part of a $200 billion multistate initiative that includes $50 million for R&D. Two new high-volume fabs at the company's headquarters in Boise, Idaho, are expected to begin operations in 2027, and an existing plant in Manassas, Va., is undergoing renovation and expansion. Micron anticipates that all of its U.S. investments will be eligible for the Advanced Manufacturing Investment Credit (AMIC).