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Amkor Technology Breaks Ground on Semiconductor Campus

Published 11/12/2025

Amkor Technology broke ground in October of 2025 on an advanced packaging and testing campus for semiconductors in Peoria, Ariz. Strategically located in the state’s growing innovation corridor, the two-phase project will offer over 750,000 sf of cleanroom space upon completion. The sophisticated hub will feature smart factory technologies and scalable production lines to meet evolving market demands for artificial intelligence (AI) and high-performance computing, as well as mobile communications and automotive applications. 

Complemented by collaborator TSMC’s front-end wafer fabrication capabilities, the $7 billion development will provide full end-to-end high-volume manufacturing. Amkor’s expanded investment in the site is supported by the CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and state and local governments. These greenfield facilities will strengthen the nation's semiconductor supply chain and support key customers such as Apple and NVIDIA. Construction of the first phase is expected to finish in mid-2027, with production beginning in early 2028.