Micron Expands Memory Manufacturing Campus in Boise

Micron Technology is constructing a next-generation memory manufacturing complex in Boise, Idaho. The $50 billion investment will create two linked high-volume fabrication facilities that will each offer 600,000 sf of cleanroom space, flanked by wings on either side for supporting equipment, over the next 20 years. Leveraging sophisticated processes and tools such as extreme ultraviolet (EUV) lithography, the 1.2 million-sf campus will strategically integrate research and development functions to accelerate semiconductor production and drive industry leadership. 

Expanded wafer manufacturing capacity will enhance national supply chain resilience while addressing increasing demand from data centers and artificial intelligence (AI), as well as the automotive, industrial, and mobile communication sectors. Representing the first new domestic memory plant in two decades, the project is estimated to generate 17,000 jobs throughout the state and 2,000 directly with Micron.

Targeting LEED Gold certification, the site will be powered by 100 percent renewable electricity and is expected to attain 100 percent water conservation through reuse, recycling, or restoration. Sustainable building systems and infrastructure align with the company’s global target to achieve a 42 percent reduction in greenhouse gas emissions from operations by 2030 and net-zero emissions by 2050.

Hoffman Construction Company is serving as general contractor for the development and ground was broken in September of 2022. Dynamic random-access memory (DRAM) output is slated to begin at the first fab in mid-2027 with operations commencing at the second fab in late 2028. Supported by grants and credits provided by the CHIPS and Science Act, the Boise complex is part of Micron’s broader $200 billion U.S. investment that will establish four high-volume semiconductor production plants in New York, expand and renovate existing facilities in Virginia, and enable advanced high bandwidth memory (HBM) packaging capabilities.