Texas A&M University Breaks Ground on Semiconductor Institute

Texas A&M University broke ground in April of 2026 on the Texas A&M Semiconductor Institute on the RELLIS campus in Bryan. Designed by Stantec, the $226 million research and development building aims to elevate regional leadership in the industry and advance next-generation discoveries. The collaborative 80,000-sf structure will feature Class 100 and 1000 cleanrooms modeled after fabrication facilities to enable full-scale production. Offering leading-edge 300mm equipment, these sophisticated settings will harness a reconfigurable layout to adapt to evolving programmatic needs.

The two-story institute will employ robust vibration control and environmental stability strategies to meet strict performance criteria. Specialized laboratories and support rooms will focus on lithography, metrology, packaging, radio frequency, photonics, process and tooling development, and testing and evaluation. A skilled trade lab for workforce training will promote economic growth. Loading docks will be accompanied by hazardous materials handling areas and venues for storage and distribution.

Funded through the 2023 Texas Chips Act, the dynamic facility is slated for completion in 2028. Firms lending their expertise to the project include Affiliated Engineers, Inc. (AEI), Kimley-Horn, Moose Engineers, Martinez Moore Engineers, Colin Gordon Associates, Glo Consulting, Jensen Hughes, CPP, Vitatech Electromagnetics, The MXY Group, Vermeulens, Datacom, and Blu Fish Collaborative.